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Lihe Abrasives is a high-end precision grinding wheel manufacturer with over 40 years of experience. We produce and develop a comprehensive range of grinding products. - Technical Service
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Semiconductor Grinding
The specially designed fine-grained ceramic-bonded thinning wheel utilizes proprietary PoreX technology and a liquid processing method, ensuring high product stability and unique microstructure, making it ideal for grinding processes in the semiconductor industry.
Technical features:
（１）Super stability
（２）Long service life
（３）Low grinding resistance
（４）High grinding efficiency
（５）High-quality surface
RIHON
Semiconductor Grinding
At present, RIHON can realize the directional plane machining of wafers in semiconductor grinding, and has developed back thinning wheels, which can shorten the time while improving the machining quality and reducing grinding damage. There are also wafer thinning wheels for pre-grinding, post-grinding and fine grinding of discrete devices. RIHON provides high-precision diamond grinding wheel solutions to help you solve the grinding challenges of materials and instruments in the ultra-precision grinding industry.
Detailed Parameter Table
| Range |
#400– #12000 |
| Abrasive Material |
Diamond |
| Bond Type |
Resin bond |
|
Size |
Customizable |
| Hardness |
H – R (customized according to application) |
|
Performance Metrics |
|
|
Cutting Accuracy |
± 3 μm |
|
Surface Roughness |
≤ 0.1 μm |
|
Service Life |
≥ 3000 cuts (by material and process) |
|
Applications |
|
|
Typical Craftsmanship |
Wafer cutting, Dicing, Chamfering, Grinding and polishing |
|
Main Application |
Silicon wafers (Si), Silicon carbide (SiC), Sapphire (Sapphire), Compound semiconductors (GaAs, GaN) |
|
Applicable Equipment |
DISCO/ADT/Tokyo Seimitsu/Okamoto and other mainstream dicing machines |
Recommended Industry
Optics and optoelectronics industry
• Aspheric/free-form optical lenses
Aerospace industry
• Satellite inertial navigation parts
• Tongue and groove processing of aero engine blades
Medical and Bioengineering
• Polishing of human joints surface
• Nanoscale surface treatment for medical devices
New energy electric vehicle industry
• Motor shaft high-precision grinding
